Electrical Engineer (Launcher)

About the role

About Us Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces. Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected. Overview Harmattan AI is developing new hardware products within the Launcher module: field-deployable drone launchers designed to be deployed and operated autonomously in demanding field environments. These products require dedicated electronics design with complex architecture in a constrained environment – PCBs integrating power conversion, energy management, control and communication interfaces – optimised for cost at volume. The Launcher team is seeking a dedicated hardware engineer to own electronics design end-to-end and accelerate the path to production milestones. Ideal candidate A senior hardware engineer who has designed and shipped complex PCBs, ideally mixing digital and significant power (hundreds of watts), into production. They are rigorous on schematics, layout, and bring-up, and have a strong instinct for cost and manufacturability. They design with real-world operating conditions in mind - temperature, moisture, surges - and an interest in battery thermal management; direct experience of outdoor-deployed equipment is a plus rather than a prerequisite. They are comfortable working autonomously in a small team and can bridge hardware and firmware. Skills required PCB schematic and layout design (Altium Designer preferred) Power electronics design: ~300 W DC/DC conversion, protection, derating, efficiency and thermal budgets Thermal regulation: temperature sensing and control loops, battery storage temperature management, heatsinking Power over Ethernet (IEEE 802.3af/at/bt): combined power and data delivery, isolation, cable budgets Mixed-signal design: power management, MCU interfaces, communication buses (SPI, I2C, UART, USB, CAN, Ethernet) Hardware bring-up and debug: bench equipment proficiency DFM/DFA for PCB manufacturing and assembly Component selection and BOM management Experience in lightning and surge protection is a plus Responsibilities: Schematic Design - Design complete schematics for mixed-signal and power boards, from power stages to digital and communication sections. PCB Layout & Routing - Perform or lead board placement and routing with attention to signal integrity, EMC, and power-path constraints. Power & Thermal Architecture - Define and validate the power architecture of the product and the thermal strategy, including battery temperature management. Environmental Robustness - Ensure the electronics withstand outdoor deployment conditions and define the associated qualification plan. Component Selection & BOM Optimization - Select components with cost, availability, and reliability in mind; drive BOM cost reduction for mass production volumes. Hardware Bring-up & Debug - Lead board bring-up, debug issues with oscilloscopes, power bench equipment, and other bench equipment; write bring-up scripts when needed. EMC & Safety Compliance - Address EMC challenges; ensure signal integrity across the board and electrical safety of the power and battery sections. Collaboration with Embedded SW - Work closely with the embedded software engineer to define hardware/software interfaces; support firmware bring-up. Collaboration with Mechanical - Ensure seamless PCB integration into mechanical enclosures (connectors, mounting, thermal, sealing, shielding). Supplier & Manufacturing Ramp-up - Qualify PCB manufacturers and assembly houses; support DFM/DFA review for production; manage NPI transitions. Documentation - Maintain

Skills